• DocumentCode
    1485365
  • Title

    Quality Standardization for Polydimethysiloxane-Based Optical Interconnect Production From Optical Aspects

  • Author

    Cai, Dengke ; Neyer, Andreas

  • Author_Institution
    Fak. fur Elektrotechnik und Informationstechnik, Tech. Univ. Dortmund, Dortmund, Germany
  • Volume
    22
  • Issue
    13
  • fYear
    2010
  • fDate
    7/1/2010 12:00:00 AM
  • Firstpage
    996
  • Lastpage
    998
  • Abstract
    The influences of waveguide materials, fabrication conditions, and packaging substrates on the optical waveguide properties of electrical-optical circuit boards have been investigated by systematic variation of these conditions. Pt catalyst in polydimethysiloxane, casting mould sidewall roughness, interlay thickness, and packaging substrates show sensitive impact on optical waveguide insertion loss and in terms of defined target of optical loss, the basic quality criteria can be defined before production.
  • Keywords
    casting; optical fabrication; optical interconnections; optical losses; optical polymers; optical waveguides; packaging; standardisation; casting mould; catalyst; electrical-optical circuit boards; interlay thickness; optical interconnect; optical waveguide insertion loss; packaging substrates; polydimethysiloxane; sidewall roughness; Optical interconnect; polydimethysiloxane (PDMS); production; quality standardization;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2010.2049010
  • Filename
    5460904