DocumentCode
1485599
Title
A New Hybrid Field-Circuit Approach to Model the Power–Ground Planes With Narrow Slots
Author
Zou, Guo-Ping ; Li, Er-Ping ; Wei, Xing-Chang ; Luo, Guang-Xiao ; Cui, Xiang
Author_Institution
Sch. of Electr. & Electron. Eng., North China Electr. Power Univ., Beijing, China
Volume
52
Issue
2
fYear
2010
fDate
5/1/2010 12:00:00 AM
Firstpage
340
Lastpage
345
Abstract
Narrow slots are often employed in printed circuit board and electronic package designs to isolate the power noise coupling. In this paper, an equivalent circuit method is proposed to analyze the power and signal integrity of gapped power-ground (PG) planes. With this method, the whole gapped PG planes are divided into two regions: one is a parallel-plane structure, and another is a slot structure. An integral-equation equivalent circuit method is used to model the arbitrarily shaped parallel-plane structure. Meanwhile, the transmission-line method is used to model the slot structure. Finally, the whole modeling of gapped PG planes can be obtained by integrating the aforementioned two equivalent networks. Numerical examples reveal that this circuit approach is efficient and accurate, in comparing with the available methods.
Keywords
electronics packaging; equivalent circuits; integral equations; printed circuits; transmission lines; electronic package designs; gapped power-ground plane model; hybrid field-circuit approach; integral-equation equivalent circuit method; power noise coupling; printed circuit board and; shaped parallel-plane structure; signal integrity; slot structure; transmission-line method; Circuit noise; Circuit simulation; Coupling circuits; Electronics packaging; Equivalent circuits; Finite difference methods; Impedance; Integral equations; Printed circuits; Signal analysis; Transmission lines; Electronic packaging; equivalent circuit; integral equation; power/signal integrity (PI/SI);
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2010.2042604
Filename
5460941
Link To Document