• DocumentCode
    1485599
  • Title

    A New Hybrid Field-Circuit Approach to Model the Power–Ground Planes With Narrow Slots

  • Author

    Zou, Guo-Ping ; Li, Er-Ping ; Wei, Xing-Chang ; Luo, Guang-Xiao ; Cui, Xiang

  • Author_Institution
    Sch. of Electr. & Electron. Eng., North China Electr. Power Univ., Beijing, China
  • Volume
    52
  • Issue
    2
  • fYear
    2010
  • fDate
    5/1/2010 12:00:00 AM
  • Firstpage
    340
  • Lastpage
    345
  • Abstract
    Narrow slots are often employed in printed circuit board and electronic package designs to isolate the power noise coupling. In this paper, an equivalent circuit method is proposed to analyze the power and signal integrity of gapped power-ground (PG) planes. With this method, the whole gapped PG planes are divided into two regions: one is a parallel-plane structure, and another is a slot structure. An integral-equation equivalent circuit method is used to model the arbitrarily shaped parallel-plane structure. Meanwhile, the transmission-line method is used to model the slot structure. Finally, the whole modeling of gapped PG planes can be obtained by integrating the aforementioned two equivalent networks. Numerical examples reveal that this circuit approach is efficient and accurate, in comparing with the available methods.
  • Keywords
    electronics packaging; equivalent circuits; integral equations; printed circuits; transmission lines; electronic package designs; gapped power-ground plane model; hybrid field-circuit approach; integral-equation equivalent circuit method; power noise coupling; printed circuit board and; shaped parallel-plane structure; signal integrity; slot structure; transmission-line method; Circuit noise; Circuit simulation; Coupling circuits; Electronics packaging; Equivalent circuits; Finite difference methods; Impedance; Integral equations; Printed circuits; Signal analysis; Transmission lines; Electronic packaging; equivalent circuit; integral equation; power/signal integrity (PI/SI);
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2010.2042604
  • Filename
    5460941