Title :
High-speed photoreceivers using solder bumps and microstrip lines formed on a silicon optical bench
Author :
Akahori, Yuji ; Ohyama, Takaharu ; Yamada, Takashi ; Katoh, Kazutoshi ; Ito, Toshio
Author_Institution :
NTT Opto-Electron. Labs., Ibaraki, Japan
fDate :
4/1/1999 12:00:00 AM
Abstract :
High-speed photoreceiver modules using silicon optical benches are described. These modules employ solder bumps for chip assembly and microstrip lines for electrical signal transmission. The assembly and wiring technologies are the same as those used in the planar lightwave circuit platforms we developed. A photoreceiver module consisting of a waveguide photodiode showed a very wide bandwidth greater than 20 GHz, and together with a spotsize-converted semiconductor optical amplifier, operated as an optical preamplifier that showed good receiver sensitivity of -20.3 dBm at 10 Gb/s nonreturn-to-zero.
Keywords :
integrated circuit packaging; integrated optoelectronics; microstrip lines; modules; optical receivers; semiconductor optical amplifiers; silicon; 10 Gbit/s; 20 GHz; Gb/s nonreturn-to-zero; Si; chip assembly; electrical signal transmission; high-speed photoreceiver modules; high-speed photoreceivers; microstrip lines; optical preamplifier; planar lightwave circuit platforms; receiver sensitivity; silicon optical bench; solder bumps; spotsize-converted semiconductor optical amplifier; wiring technologies; Assembly; Circuits; High speed optical techniques; Microstrip; Optical receivers; Optical sensors; Optical waveguides; Semiconductor waveguides; Silicon; Wiring;
Journal_Title :
Photonics Technology Letters, IEEE
