High-speed photoreceivers using solder bumps and microstrip lines formed on a silicon optical bench

Author

Akahori, Yuji ; Ohyama, Takaharu ; Yamada, Takashi ; Katoh, Kazutoshi ; Ito, Toshio

Author_Institution

NTT Opto-Electron. Labs., Ibaraki, Japan

Volume

11

Issue

4

fYear

1999

fDate

4/1/1999 12:00:00 AM

Firstpage

454

Lastpage

456

Abstract

High-speed photoreceiver modules using silicon optical benches are described. These modules employ solder bumps for chip assembly and microstrip lines for electrical signal transmission. The assembly and wiring technologies are the same as those used in the planar lightwave circuit platforms we developed. A photoreceiver module consisting of a waveguide photodiode showed a very wide bandwidth greater than 20 GHz, and together with a spotsize-converted semiconductor optical amplifier, operated as an optical preamplifier that showed good receiver sensitivity of -20.3 dBm at 10 Gb/s nonreturn-to-zero.

Keywords

integrated circuit packaging; integrated optoelectronics; microstrip lines; modules; optical receivers; semiconductor optical amplifiers; silicon; 10 Gbit/s; 20 GHz; Gb/s nonreturn-to-zero; Si; chip assembly; electrical signal transmission; high-speed photoreceiver modules; high-speed photoreceivers; microstrip lines; optical preamplifier; planar lightwave circuit platforms; receiver sensitivity; silicon optical bench; solder bumps; spotsize-converted semiconductor optical amplifier; wiring technologies; Assembly; Circuits; High speed optical techniques; Microstrip; Optical receivers; Optical sensors; Optical waveguides; Semiconductor waveguides; Silicon; Wiring;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/68.752546

Filename

752546