DocumentCode :
1485705
Title :
Self-Packaged Millimeter-Wave Substrate Integrated Waveguide Filter With Asymmetric Frequency Response
Author :
Chen, Xiao-Ping ; Wu, Ke
Author_Institution :
Dept. of Electr. Eng., Univ. of Montreal, Montreal, QC, Canada
Volume :
2
Issue :
5
fYear :
2012
fDate :
5/1/2012 12:00:00 AM
Firstpage :
775
Lastpage :
782
Abstract :
Substrate integrated waveguide (SIW) technology provides an effective solution for the low-cost and high-performance interconnect and packaging of microwave and millimeter wave systems. In this paper, Ka-band four-degree bandpass filters having asymmetric frequency response, which are required in the design of transmit and receive diplexers for high rejection between neighboring channels, are proposed and realized on an SIW platform. The filters are self-packaged due to the fact that a conductor-backed coplanar waveguide is used to directly excite the filters. Higher-order resonant mode is used to achieve the required negative coupling on the basis of a single-layer SIW. The proposed filters, having the same center frequency of 35 GHz and pass bandwidth of 1.3 GHz, are fabricated on a conventional Rogers RT/Duroid 6002 substrate with thickness of 0.508 mm by using a low-cost printed circuit board process. Measured results of those filters, which exhibit high single-sided selectivity and minimum in-band insertion loss of about 1.25 dB, agree well with simulated results.
Keywords :
band-pass filters; electronics packaging; frequency response; millimetre wave filters; multiplexing equipment; substrate integrated waveguides; Ka-band four-degree bandpass filters; SIW technology; asymmetric frequency response; diplexers; high-performance interconnect; packaging; self-packaged millimeter-wave filter; substrate integrated waveguide technology; Cavity resonators; Couplings; Filtering theory; Passband; Resonant frequency; Substrates; Transmission line matrix methods; Asymmetric response; cross-coupling; filter; self-packaging; substrate integrated waveguide; transmission zero;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2187897
Filename :
6178775
Link To Document :
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