Title :
Micromachined semi-encapsulated spiral inductors for microelectromechanical systems (MEMS) applications
Author :
Sadler, Daniel J. ; Zhang, Wenjin ; Ahn, Chong H. ; Kim, Hi Jung ; Han, Suk Hee
Author_Institution :
Dept. of Electr. & Comput. Eng. & Comput. Sci., Cincinnati Univ., OH, USA
fDate :
9/1/1997 12:00:00 AM
Abstract :
Semi-encapsulated spiral inductors for microelectromechanical systems (MEMS) applications have been designed, fabricated, and characterized using micromachining and electroplating techniques. The inductors are fabricated on a Pyrex glass wafer using a simple three mask process and have an area of 4 mm by 4 mm. Devices consist of electroplated copper conductor lines with width 50 μm, thickness 25 μm, and spacing 30 μm; they are semi-encapsulated with an electroplated Ni-Fe (81%/19%) magnetic core. At the low frequency of 10 kHz, the inductance of the devices was measured as 1.5 μH, while they exhibited a low resistance of only 3 ohms. Their low resistance and reasonably high inductance makes them ideal in MEMS applications as either sensors or actuators
Keywords :
electroplating; encapsulation; inductors; micromachining; micromechanical devices; 10 kHz; Cu; Ni-Fe; Ni-Fe magnetic core; Pyrex glass wafer; actuator; copper conductor line; electroplating; inductance; microelectromechanical system; micromachining; resistance; semi-encapsulated spiral inductor; sensor; three mask process; Conductors; Copper; Frequency; Glass; Inductors; Magnetic cores; Microelectromechanical systems; Micromachining; Micromechanical devices; Spirals;
Journal_Title :
Magnetics, IEEE Transactions on
