• DocumentCode
    148702
  • Title

    Partner organizations

  • fYear
    2014
  • fDate
    23-25 April 2014
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The conference organizers greatly appreciate the support of the various corporate sponsors listed.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging (ICEP), 2014 International Conference on
  • Conference_Location
    Toyama, Japan
  • Print_ISBN
    978-4-904090-10-7
  • Type

    conf

  • DOI
    10.1109/ICEP.2014.6826649
  • Filename
    6826649
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=148702