High productivity sputtering system for seed layer of printed circuit board

Author

Fujinaga, T.

Author_Institution

ULVAC, Inc., Chigasaki, Japan

fYear

2014

fDate

23-25 April 2014

Firstpage

26

Lastpage

29

Abstract

To realize fine pitch pattering on printed circuit board, high productivity sputtering system for seed layer deposition is required. Roughened surface is necessary to get high adhesion by electroless plated seed layer, but seed layer formed by sputtering has high peel strength on smooth surface of dielectric material. And to achieve high productivity, high power source for sputtering has to be applied. However it causes substrate temperature rising. Most of dielectric materials are organic and weak against heat. ULVAC demonstrated high peel strength seed layer with high productivity by combination of sputtering and substrate cooling system. Seed layer deposited by sputter shows higher performance against it formed by electroless plating method.

Keywords

adhesion; dielectric materials; fine-pitch technology; printed circuit manufacture; sputter deposition; ULVAC; dielectric material; electroless plated seed layer; electroless plating method; fine pitch patterning; high peel strength seed layer; high productivity sputtering system; printed circuit board; seed layer deposition; substrate cooling system; surface roughness; Etching; Radio frequency; Rough surfaces; Sputtering; Substrates; Surface roughness; Dielectrics; Emerging Materials and Processes for 3D; Equipment; Sputtering; Thin Films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging (ICEP), 2014 International Conference on

Conference_Location

Toyama

Print_ISBN

978-4-904090-10-7

Type

conf

DOI

10.1109/ICEP.2014.6826654

Filename

6826654