Title :
High frequency multilayer chip inductors
Author :
Hsu, Jen-Yan ; Lin, Hon-Chin ; Shen, Hon-Dar ; Chen, Chi-Jen
Author_Institution :
Mater. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
fDate :
9/1/1997 12:00:00 AM
Abstract :
High frequency multilayer chip inductors for the application in the radio frequency telecommunication terminals were fabricated using low temperature sintered dielectric material. The thick-film printing and green sheet lamination processes were used for the chip fabrication. The inductors of 4.7, 12, and 22 nH were made, which exhibit self-resonant frequency of 5.3 to 2.4 GHz. The size of these monolithic inductors is 2.0 mm×1.2 mm×0.8 mm
Keywords :
inductors; laminations; sintering; thick film devices; 2.4 to 5.3 GHz; dielectric material; fabrication; green sheet lamination; high frequency multilayer chip inductor; low temperature sintering; monolithic inductor; radio frequency telecommunication terminal; self-resonant frequency; thick-film printing; Application software; Chip scale packaging; Circuits; Coils; Dielectric losses; Dielectric materials; Fabrication; Filters; Lamination; Nonhomogeneous media; Printing; Radio frequency; Temperature; Thick film inductors;
Journal_Title :
Magnetics, IEEE Transactions on
