DocumentCode
148732
Title
Evaluation of cooling performance of a piezoelectric micro blower in narrow flow passage
Author
Fukue, Takashi ; Matsuura, Yasuyuki ; Hirose, Keikichi ; Terao, Hirotoshi
Author_Institution
Dept. of Mech. Eng., Iwate Univ., Morioka, Japan
fYear
2014
fDate
23-25 April 2014
Firstpage
69
Lastpage
73
Abstract
This paper describes a cooling performance of a novel miniature piezoelectric micro blower. We especially focus on an investigation whether the piezoelectric micro blower is available for a novel cooling method of high-density packaging electronic equipment or not. In order to investigate the effectiveness of the piezoelectric micro blower, an understanding of the blower performance (P - Q curve) becomes important. Especially, the effects of narrow flow passages and components around the blower on the P - Q curve should be investigated in order to apply the blower to high-density packaging electronic equipment. In addition, because of the miniature structure of the piezoelectric micro blower, a supply flow rate of the blower becomes relatively small. Therefore, an estimation of a net cooling performance of the piezoelectric micro blower should be investigated. In this paper, we evaluated a cooling performance of the piezoelectric micro blower. We firstly evaluated the P - Q curve of the piezoelectric micro blower. Especially the effects of the electrical components mounted near the blower on the P - Q curve. It is found that the performance characteristic of the proposed blower is almost not changed regardless of the existence of the components near the blower. In addition, we secondly investigated the cooling performance of the proposed blower in a narrow flow passage with finned heat sinks experimentally. Through the investigations, we evaluated the effectiveness of the piezoelectric micro blower as the cooling method of high-density packaging electronic equipment.
Keywords
cooling; electronics packaging; flow; microfluidics; piezoelectric devices; P-Q curve; cooling performance; electronic equipment; high density packaging; narrow flow passage; piezoelectric microblower; Electronic equipment; Heat sinks; Heat transfer; Heating; Packaging; Performance evaluation; Finned Heat Sink; Forced Convection; High-Density Packaging; Piezoelectronic Micro Blower; Thermal Design of Electronic Equipment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location
Toyama
Print_ISBN
978-4-904090-10-7
Type
conf
DOI
10.1109/ICEP.2014.6826663
Filename
6826663
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