iNEMI packaging technology roadmap highlights

The pace of change in packaging technology today has accelerated to the highest rate in history. This is driven by the penetration of electronics into virtually every segment of society. Communication, transportation, education, agriculture, entertainment, health care, environmental controls of heating, cooling and humidity, defense and research all rely heavily upon electronics today. This diversity of application and the never ending demand for both lower cost and higher performance cannot be achieved without major changes in packaging architecture, materials and manufacturing processes. These new technologies include System-in-Package (SiP), Wafer Level Packaging (WLP), embedded components and Through Silicon Vias (TSV) today. In the near future, we will see additional changes with the incorporation of new polymer molecules and nano-materials still in development. The iNEMI roadmap identifies the key areas where development is required to meet the market demands of the future. The package technology needs are identified for 5 years to meet the market demands in the category of processes, materials and equipment. The continued expansion of the industry depends upon 3D integration to achieve the cost reductions and performances increases that drive the industry. The developments required will be expensive and the profit stream of any single assembly and packaging company is insufficient to complete these developments alone. This has already given rise to consolidation in the assembly and packaging industry and a rapidly growing number of consortia to reduce cost through shared research.