A microfluidic interposer based on three dimensional molded substrate technology

Three dimensional molded interconnect devices (MID) with fluidic features offer new possibilities for the packaging of microfluidic components. This paper reports about an MID based fluidic interposer to bridge the micro-macro gap of fluid delivery in microfluidic systems. The interposer is fabricated by standard MID fabrication technology and includes a metallization for electrical signals and channel structures for fluidic functions. A microfluidic test chip is assembled to the interposer by a flip-chip process. The proposed interposer is suitable for pressure and capillary driven flows. Results from pressurization testing with liquids and gases are given.