DocumentCode :
1487952
Title :
Comparison of Radiation Modeling Techniques Up to 10 GHz—Application on a Microstrip PCB Trace
Author :
Rogard, Eric ; Azanowsky, Beatrice ; Ney, Michel M.
Author_Institution :
Thales Commun., Cholet, France
Volume :
52
Issue :
2
fYear :
2010
fDate :
5/1/2010 12:00:00 AM
Firstpage :
479
Lastpage :
486
Abstract :
This paper presents a comparative study on the electromagnetic emissions modeling of a microstrip signal trace. Different modeling techniques based on transmission-line theory, simulation program with integrated circuits emphasis circuit analysis and electromagnetic topology are investigated to predict the radiated emissions up to 10 GHz. All of them use different simplifications to calculate the trace current distribution and the radiated emissions. For both matched and mismatched cases, the radiation frequency response for a fixed direction in the far-field region is calculated with an analytical method, a circuit method and a modified Kron´s method for electromagnetic compatibility. Then, results are compared with a full-wave simulation and good agreement is found over a wide frequency range.
Keywords :
current distribution; electromagnetic compatibility; frequency response; microstrip circuits; printed circuits; transmission line theory; circuit method; current distribution; electromagnetic compatibility; electromagnetic emission modeling; electromagnetic topology; far-field region; full-wave simulation; integrated circuit; microstrip PCB trace; microstrip signal trace; modified Kron method; radiation frequency response; radiation modeling techniques; simulation program; transmission-line theory; Circuit analysis; Circuit topology; Current distribution; Electromagnetic modeling; Electromagnetic radiation; Integrated circuit modeling; Microstrip; Predictive models; SPICE; Transmission lines; Electromagnetic topology (EMT); microstrip; modified Kron's method for electromagnetic compatibility (MKME); printed circuit board (PCB); radiation modeling; simulation program with integrated circuits emphasis (SPICE);
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2010.2046170
Filename :
5462938
Link To Document :
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