• DocumentCode
    148828
  • Title

    Miniaturized polarization sensors integrated with wire-grid polarizers

  • Author

    Ikeda, Shoji ; Higurashi, Eiji ; Suga, Takashi ; Oguchi, Toshiki

  • Author_Institution
    Univ. of Tokyo, Tokyo, Japan
  • fYear
    2014
  • fDate
    23-25 April 2014
  • Firstpage
    376
  • Lastpage
    379
  • Abstract
    Miniaturized polarization sensors integrated with aluminum (Al) nanowire-grid polarizers have been developed for compact optical rotary encoders. The sensor consists of Al wire grid polarizers sandwiched between two glass substrates, an InGaAs photodiode (PD) chip and a Si substrate with a cavity and through silicon vias (TSVs). Two polarizers that can detect two orthogonally polarized components were integrated in a single device. The glass substrates with wire-grid polarizers were vertically stacked on the Si substrate for chip size packaging. Integration of PD chips and sealing were performed using Au-Au surface activated bonding using atmospheric-pressure plasma with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C. The feasibility of rotational angle measurement of linear polarizer was demonstrated by differential detection of two orthogonally polarized components.
  • Keywords
    aluminium; electronics packaging; integrated optoelectronics; nanosensors; nanowires; optical polarisers; optical sensors; photodiodes; seals (stoppers); Al; Au-Au; InGaAs; PD chip; Si; TSVs; aluminum nanowire-grid polarizers; atmospheric-pressure plasma; chip size packaging; compact optical rotary encoders; glass substrates; linear polarizer; miniaturized polarization sensors; orthogonally polarized component detection; photodiode chip; rotational angle measurement; sealing; surface activated bonding; through silicon vias; wire-grid polarizers; Bonding; Glass; Optical sensors; Silicon; Substrates; Wires; polarization sensor; rotary eoncoder; surface activated bonding; wire grid polarizer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging (ICEP), 2014 International Conference on
  • Conference_Location
    Toyama
  • Print_ISBN
    978-4-904090-10-7
  • Type

    conf

  • DOI
    10.1109/ICEP.2014.6826712
  • Filename
    6826712