Title :
Miniaturized polarization sensors integrated with wire-grid polarizers
Author :
Ikeda, Shoji ; Higurashi, Eiji ; Suga, Takashi ; Oguchi, Toshiki
Author_Institution :
Univ. of Tokyo, Tokyo, Japan
Abstract :
Miniaturized polarization sensors integrated with aluminum (Al) nanowire-grid polarizers have been developed for compact optical rotary encoders. The sensor consists of Al wire grid polarizers sandwiched between two glass substrates, an InGaAs photodiode (PD) chip and a Si substrate with a cavity and through silicon vias (TSVs). Two polarizers that can detect two orthogonally polarized components were integrated in a single device. The glass substrates with wire-grid polarizers were vertically stacked on the Si substrate for chip size packaging. Integration of PD chips and sealing were performed using Au-Au surface activated bonding using atmospheric-pressure plasma with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C. The feasibility of rotational angle measurement of linear polarizer was demonstrated by differential detection of two orthogonally polarized components.
Keywords :
aluminium; electronics packaging; integrated optoelectronics; nanosensors; nanowires; optical polarisers; optical sensors; photodiodes; seals (stoppers); Al; Au-Au; InGaAs; PD chip; Si; TSVs; aluminum nanowire-grid polarizers; atmospheric-pressure plasma; chip size packaging; compact optical rotary encoders; glass substrates; linear polarizer; miniaturized polarization sensors; orthogonally polarized component detection; photodiode chip; rotational angle measurement; sealing; surface activated bonding; through silicon vias; wire-grid polarizers; Bonding; Glass; Optical sensors; Silicon; Substrates; Wires; polarization sensor; rotary eoncoder; surface activated bonding; wire grid polarizer;
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
DOI :
10.1109/ICEP.2014.6826712