• DocumentCode
    148844
  • Title

    Progress and benchmarking of CMOS-device technologies

  • Author

    Wakabayashi, H.

  • Author_Institution
    Tokyo Inst. of Technol., Yokohama, Japan
  • fYear
    2014
  • fDate
    23-25 April 2014
  • Firstpage
    434
  • Lastpage
    437
  • Abstract
    Progress of advanced CMOS device technology is reviewed by benchmarking data. To achieve further performance gains, an enhancement of Weff/Wfootprint is highly required to realize using taller fins and vertically-stacked nano-wires.
  • Keywords
    CMOS integrated circuits; nanowires; CMOS-device technology; benchmarking data; performance gains; taller fins; vertically-stacked nanowires; Benchmark testing; CMOS integrated circuits; CMOS technology; Density measurement; Logic gates; Power system measurements; Very large scale integration; advanced CMOS device; stacked nano-wire; taller fin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging (ICEP), 2014 International Conference on
  • Conference_Location
    Toyama
  • Print_ISBN
    978-4-904090-10-7
  • Type

    conf

  • DOI
    10.1109/ICEP.2014.6826721
  • Filename
    6826721
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=148844