High-performance cooling system with multi-channel electro-osmotic flow pumps for high-power 3D-ICs

Author

Kudo, Hiroyuki ; Yonekawa, T. ; Yoshimi, S. ; Oguri, Y. ; Tsukune, A. ; Kim, Yong Sin ; Kitada, H. ; Fjimoto, K. ; Kinefuchi, I. ; Matsumoto, Yuki ; Ohba, Tsuyoshi

Author_Institution

MEMS Center, Dai Nippon Printing Co., Ltd., Kashiwa, Japan

fYear

2014

fDate

23-25 April 2014

Firstpage

480

Lastpage

483

Abstract

A multi-channel electro-osmotic flow (EOF) implemented to the closed-channel cooling system (C³S) has been developed for thermal management of stacked chips (3D-ICs). The EOF pump, which was fabricated using MEMS technology, provided driving capabilities of fluid flow through the micro channel at the P_max of 1 × 10⁴ Pa and Q_max of 38 μl/min. Cooling capability as high as 140 W/cm² was demonstrated for the first time.

Keywords

cooling; electrophoresis; flow; micromechanical devices; osmosis; thermal management (packaging); three-dimensional integrated circuits; C3S; EOF pump; MEMS technology; closed channel cooling system; fluid flow; high power 3D IC; multichannel electroosmotic flow pumps; stacked chips; thermal management; Coolants; Fluids; Heating; Pumps; Silicon; Through-silicon vias; 3D-ICs; Cooling system; Electro-osmotic flow pump; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging (ICEP), 2014 International Conference on

Conference_Location

Toyama

Print_ISBN

978-4-904090-10-7

Type

conf

DOI

10.1109/ICEP.2014.6826725

Filename

6826725