Fatigue strength of through hole in printed circuit board

Author

Iwade, Shuhei ; Kinoshita, T. ; Kawakami, Tomoya ; Mizushina, Hideki ; Iinaga, Hiroshi

Author_Institution

Toyama Prefectural Univ., Imizu, Japan

fYear

2014

fDate

23-25 April 2014

Firstpage

517

Lastpage

520

Abstract

Through holes which were for electric signal communication were formed in printed circuit board. The surface of through hole was plated by thin metal and the irregularities were shaped on the free surface or on the interface due to hole-drilling process for making through holes in circuit board. Fracture of through hole was occurred by stress concentration due to its irregularity. In this study, inelastic thermal stress simulation was performed by using a large scale simulator ADVENTURECluster which was based on FEM to discuss fatigue strength around through hole of a printed circuit board.

Keywords

drilling; finite element analysis; printed circuits; stress analysis; thermal stresses; ADVENTURECluster; FEM; electric signal communication; fatigue strength; hole-drilling process; inelastic thermal stress simulation; large scale simulator; printed circuit board; stress concentration; through hole; Fatigue; Integrated circuit modeling; Plastics; Printed circuits; Strain; Stress; Thermal stresses; FEM(Finite Element Method); Fatigue strength; Printed circuit board; TCT(Thermal Cycle Test); Through hole;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging (ICEP), 2014 International Conference on

Conference_Location

Toyama

Print_ISBN

978-4-904090-10-7

Type

conf

DOI

10.1109/ICEP.2014.6826733

Filename

6826733