• DocumentCode
    148888
  • Title

    Molecular modelling approach to screen novel thermal management materials

  • Author

    Chatterjee, Avhishek

  • Author_Institution
    Mater. Sci., Accelrys, Tokyo, Japan
  • fYear
    2014
  • fDate
    23-25 April 2014
  • Firstpage
    572
  • Lastpage
    576
  • Abstract
    Variety of new advanced composites and other advanced materials are now available which provide great advantages over conventional materials for thermal management and microelectronic packaging. We have looked into the thermal conductivity for Graphite filler in different resin matrix with varying mixing ratio and density. We have compared with existing experimental data to get an understanding and then extrapolated that to for unknown combination with TiO2 nanoparticle.
  • Keywords
    carbon; composite materials; graphite; integrated circuit packaging; molecular dynamics method; polymers; resins; thermal conductivity; thermal management (packaging); TiO2; advanced composite; amorphous carbon; graphite filler; microelectronic packaging; molecular modelling approach; nanoparticle; polymer; resin matrix; thermal conductivity; thermal management material; Conductivity; Electronic packaging thermal management; Graphite; Heating; Plastics; Thermal conductivity; composite; molecular modelling; thermal conductivity; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging (ICEP), 2014 International Conference on
  • Conference_Location
    Toyama
  • Print_ISBN
    978-4-904090-10-7
  • Type

    conf

  • DOI
    10.1109/ICEP.2014.6826744
  • Filename
    6826744
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=148888