Title :
Molecular modelling approach to screen novel thermal management materials
Author :
Chatterjee, Avhishek
Author_Institution :
Mater. Sci., Accelrys, Tokyo, Japan
Abstract :
Variety of new advanced composites and other advanced materials are now available which provide great advantages over conventional materials for thermal management and microelectronic packaging. We have looked into the thermal conductivity for Graphite filler in different resin matrix with varying mixing ratio and density. We have compared with existing experimental data to get an understanding and then extrapolated that to for unknown combination with TiO2 nanoparticle.
Keywords :
carbon; composite materials; graphite; integrated circuit packaging; molecular dynamics method; polymers; resins; thermal conductivity; thermal management (packaging); TiO2; advanced composite; amorphous carbon; graphite filler; microelectronic packaging; molecular modelling approach; nanoparticle; polymer; resin matrix; thermal conductivity; thermal management material; Conductivity; Electronic packaging thermal management; Graphite; Heating; Plastics; Thermal conductivity; composite; molecular modelling; thermal conductivity; thermal management;
Conference_Titel :
Electronics Packaging (ICEP), 2014 International Conference on
Conference_Location :
Toyama
Print_ISBN :
978-4-904090-10-7
DOI :
10.1109/ICEP.2014.6826744
