Thermal management of embedded device package

Higher performance and miniaturization are current trends of electronic equipment, with many devices mounted with a high density on a printed board. The heat density of devices is also increasing. Heat causes various problems in devices, for example, it reduces their processing speed and causes malfunctions. Controlling the thermal resistance of packages is essential for their development. The thermal resistance can be estimated by numerical analysis and accurate estimation is important. This paper describes thermal management by thermal analysis of the Wide Strip-Fan Out package (WFOP™) produced by J-Devices, which is an embedded device package using a metal plate as a base plate. Samples with test element groups were fabricated and the correlation between measurement and simulation results was examined. The accuracy of simulation was improved by reviewing both the measurement data and the simulation models. Finally low-thermal-resistance packages were realized using the method of simulation.