• DocumentCode
    148925
  • Title

    High-ON/OFF-contrast 10-Gb/s silicon Mach-zehnder modulator in high-speed low-loss package

  • Author

    Ishihara, H. ; Oda, K. ; Ori, Teijiro ; Goi, Kazuhiro ; Ogawa, Koichi ; Tsung-Yang Liow ; Xiaoguang Tu ; Guo-Qiang Lo ; Dim-Lee Kwong

  • Author_Institution
    Fujikura Ltd., Sakura, Japan
  • fYear
    2014
  • fDate
    23-25 April 2014
  • Firstpage
    680
  • Lastpage
    683
  • Abstract
    10-Gb/s silicon-based Mach-Zehnder modulator is packaged and characterized. The I/O sections of the modulator chip are located at longer-facet sides using bends waveguides for enhancing modulation bandwidth by using short straight configuration of traveling-wave electrodes. Low-insertion loss and high-return-loss optical coupling structure between input/output lenses and the modulator chip is achieved with optical coupling, where both of chip facets and inverted-taper mode-field-convertors are angled with respect to incident light beam. 3-dB electro-optic bandwidth is as high as 12.0-GHz and optical insertion loss is 9-dB or lower. High-contrast eye diagram with an extinction ratio of 13.8-dB is obtained.
  • Keywords
    electronics packaging; elemental semiconductors; modulators; optical losses; silicon; Mach-Zehnder modulator; Si; bends waveguides; chip facets; high return loss optical coupling structure; high speed low loss package; inverted taper mode field convertors; low insertion loss; modulator chip; traveling wave electrodes; Integrated optics; Optical attenuators; Optical coupling; Optical losses; Optical modulation; Optical waveguides; 10-Gb/s NRZ-OOK; Traveling-wave electrodes; lens coupling; silicon modulator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging (ICEP), 2014 International Conference on
  • Conference_Location
    Toyama
  • Print_ISBN
    978-4-904090-10-7
  • Type

    conf

  • DOI
    10.1109/ICEP.2014.6826765
  • Filename
    6826765