Multi-channel and high-density hybrid integrated light source by thermal management for low power consumption for ultra-high bandwidth optical interconnection

To realize an over 10-Tbit/s bandwidth optical interconnection, a 1000-channel light source was demonstrated by using novel spot-size converters with a SiO_x slab layer for a wide fabrication margin and by optimization done in consideration of the thermal interference between each channel in an LD array and also between the LD array chips for low power consumption. We expect the multi-channel and high-density light source to be easily adapted to a photonics-electronics convergence system for ultra-high bandwidth inter-chip interconnection.