Organic-inorganic hybrid material for optical interconnects and application to optical coupling method

We have developed an organic-inorganic hybrids material having a high thermal stability and low optical loss for telecommunication wavelength. The material is designed to solvent less resin, which is free radical curable with heating or UV exposure at room temperature. And the material shows high thermal stability for soldering process. We tried to fabricate both step-index optical waveguide and graded-index optical waveguide. Optical property was also evaluated. As a result, the cured material showed good low attenuation for Near-IR region such as 850nm, 1310nm and 1550nm. On the other hand, we demonstrated to fabricate optical pillar as a method of optical coupling for optical interconnects. Also, we demonstrated to fabricate self-written waveguide and micro lens array for other method of optical coupling.