• DocumentCode
    1489532
  • Title

    Time-Delay-Integration Architectures in CMOS Image Sensors

  • Author

    Lepage, Gérald ; Bogaerts, Jan ; Meynants, Guy

  • Author_Institution
    CMOSIS, Antwerp, Belgium
  • Volume
    56
  • Issue
    11
  • fYear
    2009
  • Firstpage
    2524
  • Lastpage
    2533
  • Abstract
    Difficulty and challenges of implementing time-delay-integration (TDI) functionality in a CMOS technology are studied: synchronization of the samples forming a TDI pixel, adder matrix outside the array, and addition noise. Existing and new TDI sensor architecture concepts with snapshot shutter, rolling shutter, or orthogonal readout are presented. An optimization method is then introduced to inject modulation transfer function and quantum efficiency specification in the architecture definition. Moderate spatial and temporal oversamplings are combined to achieve near charge-coupled device (CCD) class performances, resulting in an acceptable design complexity. Finally, CCD and CMOS dynamic range and signal-to-noise ratio are conceptually compared.
  • Keywords
    CMOS image sensors; optimisation; synchronisation; CMOS image sensors; TDI sensor architecture; charge-coupled device class performances; optimisation method; quantum efficiency specification; signal-to-noise ratio; snapshot shutter; synchronization; time-delay-integration architectures; time-delay-integration functionality; CMOS image sensors; Charge coupled devices; Detectors; Image sensors; Layout; Optical sensors; Pixel; Sensor arrays; Signal to noise ratio; Transfer functions; Dynamic modulation transfer function (MTF); image sensor; optical transfer functions; pushbroom; time-delay integration (TDI);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2009.2030648
  • Filename
    5272462