DocumentCode
1489532
Title
Time-Delay-Integration Architectures in CMOS Image Sensors
Author
Lepage, Gérald ; Bogaerts, Jan ; Meynants, Guy
Author_Institution
CMOSIS, Antwerp, Belgium
Volume
56
Issue
11
fYear
2009
Firstpage
2524
Lastpage
2533
Abstract
Difficulty and challenges of implementing time-delay-integration (TDI) functionality in a CMOS technology are studied: synchronization of the samples forming a TDI pixel, adder matrix outside the array, and addition noise. Existing and new TDI sensor architecture concepts with snapshot shutter, rolling shutter, or orthogonal readout are presented. An optimization method is then introduced to inject modulation transfer function and quantum efficiency specification in the architecture definition. Moderate spatial and temporal oversamplings are combined to achieve near charge-coupled device (CCD) class performances, resulting in an acceptable design complexity. Finally, CCD and CMOS dynamic range and signal-to-noise ratio are conceptually compared.
Keywords
CMOS image sensors; optimisation; synchronisation; CMOS image sensors; TDI sensor architecture; charge-coupled device class performances; optimisation method; quantum efficiency specification; signal-to-noise ratio; snapshot shutter; synchronization; time-delay-integration architectures; time-delay-integration functionality; CMOS image sensors; Charge coupled devices; Detectors; Image sensors; Layout; Optical sensors; Pixel; Sensor arrays; Signal to noise ratio; Transfer functions; Dynamic modulation transfer function (MTF); image sensor; optical transfer functions; pushbroom; time-delay integration (TDI);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2009.2030648
Filename
5272462
Link To Document