DocumentCode :
1489532
Title :
Time-Delay-Integration Architectures in CMOS Image Sensors
Author :
Lepage, Gérald ; Bogaerts, Jan ; Meynants, Guy
Author_Institution :
CMOSIS, Antwerp, Belgium
Volume :
56
Issue :
11
fYear :
2009
Firstpage :
2524
Lastpage :
2533
Abstract :
Difficulty and challenges of implementing time-delay-integration (TDI) functionality in a CMOS technology are studied: synchronization of the samples forming a TDI pixel, adder matrix outside the array, and addition noise. Existing and new TDI sensor architecture concepts with snapshot shutter, rolling shutter, or orthogonal readout are presented. An optimization method is then introduced to inject modulation transfer function and quantum efficiency specification in the architecture definition. Moderate spatial and temporal oversamplings are combined to achieve near charge-coupled device (CCD) class performances, resulting in an acceptable design complexity. Finally, CCD and CMOS dynamic range and signal-to-noise ratio are conceptually compared.
Keywords :
CMOS image sensors; optimisation; synchronisation; CMOS image sensors; TDI sensor architecture; charge-coupled device class performances; optimisation method; quantum efficiency specification; signal-to-noise ratio; snapshot shutter; synchronization; time-delay-integration architectures; time-delay-integration functionality; CMOS image sensors; Charge coupled devices; Detectors; Image sensors; Layout; Optical sensors; Pixel; Sensor arrays; Signal to noise ratio; Transfer functions; Dynamic modulation transfer function (MTF); image sensor; optical transfer functions; pushbroom; time-delay integration (TDI);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2009.2030648
Filename :
5272462
Link To Document :
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