DocumentCode :
1489549
Title :
Enhanced Hole Transport in Short-Channel Strained-SiGe p-MOSFETs
Author :
Gomez, Leonardo ; Hashemi, Pouya ; HOyt, Judy L.
Author_Institution :
Microsyst. Technol. Labs., Massachusetts Inst. of Technol., Cambridge, MA, USA
Volume :
56
Issue :
11
fYear :
2009
Firstpage :
2644
Lastpage :
2651
Abstract :
Hole mobility and velocity are extracted from scaled strained-Si0.45Ge0.55 channel p-MOSFETs on insulator. Devices have been fabricated with sub-100-nm gate lengths, demonstrating hole mobility and velocity enhancements in strained- Si0.45Ge0.55 channel devices relative to Si. The effective hole mobility is extracted utilizing the dR/dL method. A hole mobility enhancement is observed relative to Si hole universal mobility for short-channel devices with gate lengths ranging from 65 to 150 nm. Hole velocities extracted using several different methods are compared. The hole velocity of strained-SiGe p-MOSFETs is enhanced over comparable Si control devices. The hole velocity enhancements extracted are on the order of 30%. Ballistic velocity simulations suggest that the addition of (110) uniaxial compressive strain to Si0.45Ge0.55 can result in a more substantial increase in velocity relative to relaxed Si.
Keywords :
MOSFET; silicon compounds; SiGe; ballistic velocity simulations; enhanced hole transport; hole mobility; short-channel devices; short-channel strained-SiGe p-MOSFET; CMOS technology; Compressive stress; Degradation; Germanium silicon alloys; Insulation; MOSFET circuits; Performance gain; Silicon germanium; Strain control; Uniaxial strain; Hole mobility; hole velocity; p-MOSFET; silicon germanium; uniaxial stress;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2009.2031043
Filename :
5272466
Link To Document :
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