Impact properties of Sn-3Ag-0.5Cu solder ball joint with epoxy-based flux

Author

Ishiyama, Atsushi ; Shohji, Ikuo ; Ganbe, Tatsuya ; Watanabe, Hiromi

Author_Institution

Grad. Sch. of Sci. & Technol., Gunma Univ., Kiryu, Japan

fYear

2014

fDate

23-25 April 2014

Firstpage

766

Lastpage

769

Abstract

Epoxy-based flux has been developed to improve the impact reliability of the lead-free solder ball joint. The improvement effect of impact properties of the solder ball joint with epoxy-based flux was examined. Residue of epoxy-based flux is left around the solder ball joint and reinforces the joint. Thus interfacial fracture is inhibited and solder fracture increases. The solder ball joint with epoxy-based flux has superior shear strength and impact toughness compared with the joint fabricated with conventional rosin-based flux.

Keywords

ball grid arrays; fracture toughness; impact strength; resins; shear strength; silver alloys; solders; tin alloys; SnAgCu; epoxy-based flux; impact properties; impact reliability; impact toughness; interfacial fracture; lead-free solder ball joint; rosin-based flux; shear strength; solder fracture; Aging; Electrodes; Force; Gold; Joints; Nickel; Reliability; Sn-3Ag-0.5Cu; ball shear test; epoxy-based flux; impact properties; solder ball joint;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging (ICEP), 2014 International Conference on

Conference_Location

Toyama

Print_ISBN

978-4-904090-10-7

Type

conf

DOI

10.1109/ICEP.2014.6826784

Filename

6826784