• DocumentCode
    1489740
  • Title

    Time-Domain Investigation on Cable-Induced Transient Coupling Into Metallic Enclosures

  • Author

    Liu, Qi-Feng ; Yin, Wen-Yan ; Tang, Min ; Liu, Pei Guo ; Mao, Jun-Fa ; Liu, Qing Huo

  • Author_Institution
    Center for Microwave & RF Technol., Shanghai Jiao Tong Univ., Shanghai, China
  • Volume
    51
  • Issue
    4
  • fYear
    2009
  • Firstpage
    953
  • Lastpage
    962
  • Abstract
    A hybrid time-domain method is proposed for characterizing electromagnetic interference (EMI) signals coupled into some composite structures with metallic enclosures, braided shielded cable, printed circuit boards, and even lumped active devices. In order to rapidly capture the induced interior EMI, the finite-difference time-domain, modified node analysis, and multiconductor transmission lines methods are combined together and implemented successfully. Numerical investigation is carried out to demonstrate the frequency-dependent transfer impedance of the coaxial cable, the induced voltage at the place of active loaded element in the transmission line network, and the enclosure shielding effectiveness of these composite enclosures. The captured transient response information is useful for further designing electromagnetic protection of the inner circuits against the impact of voltage or current surge caused by nonintentional as well as intentional electromagnetic interference.
  • Keywords
    coaxial cables; electromagnetic coupling; electromagnetic interference; electromagnetic shielding; finite difference time-domain analysis; multiconductor transmission lines; transient response; transmission line theory; EMI signal; cable-induced transient coupling; coaxial cable; composite structures; electromagnetic interference signals; electromagnetic protection; enclosure shielding effectiveness; finite difference time-domain method; frequency-dependent transfer impedance; hybrid time-domain method; lumped active devices; metallic enclosures; modified node analysis; multiconductor transmission lines methods; printed circuit boards; transient response; transmission line network; Cable shielding; Coupling circuits; Electromagnetic coupling; Electromagnetic interference; Electromagnetic transients; Multiconductor transmission lines; Power cables; Power system transients; Time domain analysis; Voltage; Composite metallic rectangular enclosures; electromagnetic pulses; finite-difference time domain (FDTD); intentional electromagnetic interference; modified node analysis; multiconductor transmission lines; transient response;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2009.2029347
  • Filename
    5272674