DocumentCode
1490240
Title
GaN Power Transistors on Si Substrates for Switching Applications
Author
Ikeda, Nariaki ; Niiyama, Yuki ; Kambayashi, Hiroshi ; Sato, Yoshihiro ; Nomura, Takehiko ; Kato, Sadahiro ; Yoshida, Seikoh
Author_Institution
Yokohama R&D Labs., Furukawa Electr. Co., Ltd., Yokohama, Japan
Volume
98
Issue
7
fYear
2010
fDate
7/1/2010 12:00:00 AM
Firstpage
1151
Lastpage
1161
Abstract
In this paper, GaN power transistors on Si substrates for power switching application are reported. GaN heterojunction field-effect transistor (HFET) structure on Si is an important configuration in order to realize a low loss and high power devices as well as one of the cost-effective solutions. Current collapse phenomena are discussed for GaN-HFETs on Si substrate, resulting in suppression of the current collapse due to using the conducting Si substrate. Furthermore, attempts for normally off GaN-FETs were examined. A hybrid metal-oxide-semiconductor HFET structure is a promising candidate for obtaining devices with a lower on-resistance (Ron) and a high breakdown voltage (Vb).
Keywords
gallium compounds; power HEMT; switching circuits; wide band gap semiconductors; GaN; GaN power transistors; GaN-HFET; Si; current collapse phenomena; heterojunction field-effect transistor structure; high breakdown voltage; high power devices; hybrid metal-oxide-semiconductor HFET structure; low loss devices; low on-resistance; power switching; Aluminum gallium nitride; Electron devices; FETs; Gallium nitride; HEMTs; Heterojunctions; MODFETs; Power transistors; Silicon carbide; Substrates; Current collapse; GaN power transistor; MOS-HFET; heterojunction field-effect transistor (HFET);
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/JPROC.2009.2034397
Filename
5464313
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