DocumentCode
1490476
Title
Dielectric-Free Fabrication of Compact 30-GHz Photodetectors Using the Isolated Pedestal Contact Configuration
Author
Daunt, Chris L M ; Yang, Hua ; Han, Wei ; Thomas, Kevin ; Pelucchi, Emanuele ; Corbett, Brian ; Peters, Frank H.
Author_Institution
Tyndall Nat. Inst., Cork, Ireland
Volume
24
Issue
13
fYear
2012
fDate
7/1/2012 12:00:00 AM
Firstpage
1082
Lastpage
1084
Abstract
We demonstrate a rapid fabrication process for high-speed waveguide-based photodetectors operating above 30 GHz. The process requires no dielectric planarization, and forms planar ground-signal-ground (GSG) contacts, which is more robust and ideally suitable for flip-chip packaging.
Keywords
MOCVD coatings; flip-chip devices; millimetre wave detectors; photodetectors; compact photodetectors; dielectric-free fabrication; flip-chip packaging; frequency 30 GHz; isolated pedestal contact configuration; planar ground-signal-ground contact; Bridge circuits; Capacitance; Dielectrics; Indium phosphide; Metals; Optical waveguides; Photodetectors; Optical device fabrication; photodetectors; photodiodes;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2012.2194484
Filename
6180186
Link To Document