DocumentCode :
1490476
Title :
Dielectric-Free Fabrication of Compact 30-GHz Photodetectors Using the Isolated Pedestal Contact Configuration
Author :
Daunt, Chris L M ; Yang, Hua ; Han, Wei ; Thomas, Kevin ; Pelucchi, Emanuele ; Corbett, Brian ; Peters, Frank H.
Author_Institution :
Tyndall Nat. Inst., Cork, Ireland
Volume :
24
Issue :
13
fYear :
2012
fDate :
7/1/2012 12:00:00 AM
Firstpage :
1082
Lastpage :
1084
Abstract :
We demonstrate a rapid fabrication process for high-speed waveguide-based photodetectors operating above 30 GHz. The process requires no dielectric planarization, and forms planar ground-signal-ground (GSG) contacts, which is more robust and ideally suitable for flip-chip packaging.
Keywords :
MOCVD coatings; flip-chip devices; millimetre wave detectors; photodetectors; compact photodetectors; dielectric-free fabrication; flip-chip packaging; frequency 30 GHz; isolated pedestal contact configuration; planar ground-signal-ground contact; Bridge circuits; Capacitance; Dielectrics; Indium phosphide; Metals; Optical waveguides; Photodetectors; Optical device fabrication; photodetectors; photodiodes;
fLanguage :
English
Journal_Title :
Photonics Technology Letters, IEEE
Publisher :
ieee
ISSN :
1041-1135
Type :
jour
DOI :
10.1109/LPT.2012.2194484
Filename :
6180186
Link To Document :
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