• DocumentCode
    1490723
  • Title

    The Impact of On-Wafer Calibration Method on the Measured Results of Coplanar Waveguide Circuits

  • Author

    Li, Qian ; Melde, Kathleen L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA
  • Volume
    33
  • Issue
    1
  • fYear
    2010
  • Firstpage
    285
  • Lastpage
    292
  • Abstract
    This paper compares four commonly used on-wafer calibration methods including multiline thru-reflect-line (TRL), line-reflect-reflect-match, line-reflect-match, and short-open-load- thru, for three diverse coplanar waveguide (CPW) circuits. The magnitudes and phases of S 11 and S 21 of the CPW circuits are compared to quantify how the specific calibration method influences measured scattering parameters. Special care is taken to ensure that the measured scattering parameters are normalized to the same reference impedance and reference plane for accurate comparison. The measured results are compared with full-wave simulations to provide additional assessment of accuracy. A method to de-embed the discontinuity of the CPW at the probe tip and the CPW of the test structures is presented. The effect of probe-to-device-under-test discontinuity is effectively modeled by one- or two- section of shunt capacitor and series inductor. The results show that the multiline TRL calibration method provides the highest transmission coefficient repeatability on not well-matched circuits and highest accuracy on the three circuits in this paper up to 40 GHz.
  • Keywords
    S-parameters; calibration; circuit testing; coplanar waveguides; coplanar waveguide circuits; line-reflect-match; line-reflect-reflect-match; multiline TRL calibration; multiline thru-reflect-line; on-wafer calibration; probe-to-device-under-test discontinuity; reference impedance; reference plane; scattering parameters; series inductor; short-open-load-thru; shunt capacitor; test structures; Coplanar waveguide (CPW); high-frequency packaging; on-wafer measurements;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2009.2025365
  • Filename
    5276812