DocumentCode :
1491136
Title :
Thermal deformation of a tension mask and beam landing shift for a perfectly flat CRT under localized heating
Author :
Jang, Bo Woong ; Shin, Woon Seo ; You, Se Joon
Author_Institution :
DISPLAY R&D Center, LG Electron. Inc., Seoul, South Korea
Volume :
45
Issue :
1
fYear :
1999
fDate :
2/1/1999 12:00:00 AM
Firstpage :
243
Lastpage :
251
Abstract :
Thermal deformation of a tension mask under localized heating was analyzed using the finite element method. Landing shift of the electron beam could be predicted based on these analysis results. In the CRT, the landing shift of the electron beam due to thermal deformation of the tension mask made the color purity of the screen worse. In order to get the final results of thermal deformation, the tensile force within the mask and the welding processes between the rail and the extended mask had to be analyzed sequentially. Then, thermo-elastic finite element analysis was performed on every part inside the CRT including the tension mask. The analysis showed that thermal radiation was the main heat transfer mechanism. Because the tension mask has numerous slits, it was efficient to model it as a shell without slits, and the effective thermal conductivity and effective elastic modulus were introduced and calculated. From the displacement analysis results of the tension mask, landing shift of the electron beam could be predicted. Experiments were also performed to confirm our analysis results. Temperature distributions and beam landing shift of the tension mask were measured and the results were in good agreement with those of analysis
Keywords :
cathode-ray tubes; deformation; electron beams; finite element analysis; temperature distribution; temperature measurement; thermal analysis; thermal conductivity; thermoelasticity; color purity; displacement analysis; effective elastic modulus; effective thermal conductivity; electron beam landing shift; experiments; finite element method; heat transfer mechanism; localized heating; perfectly flat CRT; temperature distributions; tensile force; tension mask; thermal deformation; thermal radiation; thermo-elastic FEA; welding processes; Cathode ray tubes; Electron beams; Finite element methods; Heat transfer; Heating; Performance analysis; Rails; Thermal conductivity; Thermal force; Welding;
fLanguage :
English
Journal_Title :
Consumer Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0098-3063
Type :
jour
DOI :
10.1109/30.754442
Filename :
754442
Link To Document :
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