Title :
5th Topical Meeting On Electrical Performance Of Electronic Packaging
Abstract :
Presents the front cover of the proceedings record.
Keywords :
Application specific integrated circuits; Ceramics; Electronics packaging; Flip chip; Noise measurement; Nonhomogeneous media; Power distribution; Semiconductor device measurement; Semiconductor device modeling;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TCPMB.1997.618214
