• DocumentCode
    1491926
  • Title

    Fast parameter extraction for multiconductor interconnects in multilayered dielectric media using mixture method of equivalent source and measured equation of invariance

  • Author

    Jin, Ronghong ; Cao, Yi ; Li, Zhengfan

  • Author_Institution
    Dept. of Electron. Eng., Shanghai Jiaotong Univ., China
  • Volume
    20
  • Issue
    3
  • fYear
    1997
  • fDate
    8/1/1997 12:00:00 AM
  • Firstpage
    235
  • Lastpage
    240
  • Abstract
    Measured equation of invariance (MEI) has been successfully used in many applications. It has been illustrated that the MEI is specially suitable for the decrease of computation time and computer memory space. However, for multiconductor interconnects in multilayered dielectric media, the Green´s function is complex and the integrals of Sommerfeld type are time consuming. In this paper, equivalent source and measured equation of invariance (ES-MEI), a modification of the MEI, has been presented. Based on the equivalent principle, a reasonable illustration of the MEI can be obtained by ES-MEI. The node number is further decreased and the integrals of metron multiplied Green´s function are avoided. It will be verified by several examples that the ES-MEI is very suitable for fast parameter extraction for multiconductor interconnects in multilayered dielectric media
  • Keywords
    Green´s function methods; integrated circuit interconnections; invariance; ES-MEI; Green function; Sommerfeld integral; equivalent principle; equivalent source and measured equation of invariance; mixture method; multiconductor interconnect; multilayered dielectric medium; parameter extraction; Chip scale packaging; Crosstalk; Dielectric measurements; Electronics packaging; Finite difference methods; Integral equations; Integrated circuit interconnections; Parameter extraction; Transmission line matrix methods; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.618222
  • Filename
    618222