DocumentCode
1492929
Title
Simulation on Boron Concentration Profile in Silicon Introduced by Plasma Doping
Author
Yu, Min ; Ji, Huihui ; Wang, Jinyan ; Jin, Yufeng ; Huang, Ru ; Zhang, Xing
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing, China
Volume
38
Issue
9
fYear
2010
Firstpage
2353
Lastpage
2358
Abstract
Plasma doping (PD) is a potential shallow junction technology for advanced integrated circuits manufacturing. Accurate simulation on PD is thus needed. The simulation on PD induced B concentration profile in Si is presented in this paper. A computational efficiency Molecular Dynamics (MD) method is applied. The plasma potential, the deviation of ion energy, and the injection angle are considered. The effect of physical models, including different ion species, threshold energy of displacement, energy variation model, electronic stopping model, is investigated. It is demonstrated that the proper agreement between simulation results and experimental data can be achieved for PD.
Keywords
boron; molecular dynamics method; plasma materials processing; plasma sheaths; plasma simulation; silicon; B; PD induced B concentration profile simulation; Si; advanced integrated circuits manufacturing; boron concentration profile; different ion specie effect; displacement threshold energy; energy variation model; injection angle; ion energy deviation; molecular dynamics method; physical model effect; plasma doping; plasma potential; silicon; Boron; Circuit simulation; Computational efficiency; Computational modeling; Doping profiles; Integrated circuit manufacture; Integrated circuit technology; Plasma materials processing; Plasma simulation; Silicon; Boron; plasma; simulation;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/TPS.2010.2048721
Filename
5466068
Link To Document