DocumentCode

1493139

Title

Foreword

Author

Johnson, R. Wayne

Author_Institution

Auburn University, AL

Volume

22

Issue

1

fYear

1999

Firstpage

6

Lastpage

6

Keywords

Assembly; Automotive engineering; Bonding; Ceramics; Electronics industry; Electronics packaging; Flip chip; Stress; Substrates; Wire;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/TEPM.1999.755083

Filename

755083