Title :
Development of real time/variable sensitivity warpage measurement technique and its application to plastic ball grid array package
Author :
Verma, Kaushal ; Columbus, Derek ; Han, Bongtae
Author_Institution :
Dept. of Mech. Eng., Clemson Univ., SC, USA
fDate :
1/1/1999 12:00:00 AM
Abstract :
Far infrared Fizeau interferometry (FIFI) and shadow moire with enhanced sensitivity (SMES) are developed for real time warpage measurement of microelectronics devices. The methods are implemented in a compact apparatus that is based on a computer controlled environmental chamber. The apparatus combines the two methods to provide unique capabilities of thermally induced warpage measurement with variable sensitivity, ranging from 5.3-100 μm. The methods are employed to document warpage of plastic ball grid array packages subjected to various thermal cycles
Keywords :
ball grid arrays; integrated circuit packaging; light interferometry; plastic packaging; spatial variables measurement; 5.3 to 100 micron; FIFI; computer controlled environmental chamber; enhanced sensitivity; far infrared Fizeau interferometry; plastic ball grid array package; shadow moire; thermal cycles; warpage measurement technique; Electronics packaging; Measurement techniques; Microelectronics; Optical interferometry; Optical sensors; Optical surface waves; Plastic packaging; Semiconductor device measurement; Surface topography; Thermal variables measurement;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/6104.755090
