Development of real time/variable sensitivity warpage measurement technique and its application to plastic ball grid array package

Author

Verma, Kaushal ; Columbus, Derek ; Han, Bongtae

Author_Institution

Dept. of Mech. Eng., Clemson Univ., SC, USA

Volume

22

Issue

1

fYear

1999

fDate

1/1/1999 12:00:00 AM

Firstpage

63

Lastpage

70

Abstract

Far infrared Fizeau interferometry (FIFI) and shadow moire with enhanced sensitivity (SMES) are developed for real time warpage measurement of microelectronics devices. The methods are implemented in a compact apparatus that is based on a computer controlled environmental chamber. The apparatus combines the two methods to provide unique capabilities of thermally induced warpage measurement with variable sensitivity, ranging from 5.3-100 μm. The methods are employed to document warpage of plastic ball grid array packages subjected to various thermal cycles

Keywords

ball grid arrays; integrated circuit packaging; light interferometry; plastic packaging; spatial variables measurement; 5.3 to 100 micron; FIFI; computer controlled environmental chamber; enhanced sensitivity; far infrared Fizeau interferometry; plastic ball grid array package; shadow moire; thermal cycles; warpage measurement technique; Electronics packaging; Measurement techniques; Microelectronics; Optical interferometry; Optical sensors; Optical surface waves; Plastic packaging; Semiconductor device measurement; Surface topography; Thermal variables measurement;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/6104.755090

Filename

755090