DocumentCode

1493444

Title

Abstracts

Volume

24

Issue

1

fYear

2001

Firstpage

2

Lastpage

3

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/TEPM.2001.924785

Filename

924785