DocumentCode :
1493444
Title :
Abstracts
Volume :
24
Issue :
1
fYear :
2001
Firstpage :
2
Lastpage :
3
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2001.924785
Filename :
924785
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1493444