• DocumentCode
    1495189
  • Title

    The electronic packaging handbook [Book Review]

  • Author

    Shea, John ; Schoch, K.F.

  • Volume
    17
  • Issue
    3
  • fYear
    2001
  • Firstpage
    71
  • Lastpage
    71
  • Keywords
    Assembly; Book reviews; Design engineering; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; IEEE Press; IEEE members; Manufacturing industries; Process design;
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2001.925310
  • Filename
    925310
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1495189