DocumentCode
1495745
Title
A novel configuration for 1:N multiport power dividers using series/parallel transmission-line division and a polyimide/alumina-ceramic structure for HPA module implementation
Author
Nakatsugawa, Masashi ; Nishikawa, Kenjiro
Author_Institution
NTT Network Innovation Labs., Kanagawa, Japan
Volume
49
Issue
6
fYear
2001
fDate
6/1/2001 12:00:00 AM
Firstpage
1187
Lastpage
1193
Abstract
A novel configuration for 1:N multiport power dividers using series and parallel division of the transmission lines with a polyimide/alumina-ceramic structure is proposed and successfully demonstrated. Since these circuits need only line divisions and mode transitions to function as power dividers, they inherently possess an extremely flat frequency response. The polyimide/alumina-ceramic substrate suits the three-dimensional arrangement of various kinds of transmission lines and their transitions. It is also useful in implementing high power amplifier multichip modules because the alumina substrate can hold all active devices or monolithic microwave integrated circuits and provides convenient interfaces between them and the power dividers. The line divisions and mode transitions are analyzed by a commercial electromagnetic simulator. Two types of 1:4 power dividers, which are series/parallel and parallel/series configurations, are fabricated. No peculiar resonance was observed over the frequency range of 1-8 GHz. The amplitude deviation over this range was less than 3.2 dB
Keywords
UHF power amplifiers; alumina; microwave power amplifiers; multichip modules; power dividers; 1 to 8 GHz; 1:4 power dividers; 1:N power dividers; Al2O3; HPA module implementation; MMICs; active devices; electromagnetic simulator; flat frequency response; high-power amplifier MCM; line divisions; mode transitions; monolithic microwave integrated circuits; multichip modules; multiport power dividers; parallel/series configuration; polyimide/alumina-ceramic structure; series/parallel configuration; series/parallel transmission-line division; Distributed parameter circuits; Frequency response; High power amplifiers; MMICs; Microwave devices; Microwave integrated circuits; Multichip modules; Polyimides; Power dividers; Power transmission lines;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.925519
Filename
925519
Link To Document