An efficient algorithm for the parameter extraction of 3-D interconnect structures in the VLSI circuits: domain-decomposition method

Author

Zhu, Zhenhai ; Ji, Hao ; Hong, Wei

Author_Institution

Dept. of Radio Eng., Southeast Univ., Nanjing, China

Volume

45

Issue

8

fYear

1997

fDate

8/1/1997 12:00:00 AM

Firstpage

1179

Lastpage

1184

Abstract

In this paper, the domain-decomposition method (DDM) has been used to extract the capacitance matrices of multilayered three-dimensional (3-D) interconnects in very-large-scale integration (VLSI) circuits. Different subdomains are analyzed separately, so the most efficient method can be chosen for every subdomain. Therefore, the DDM can greatly reduce the algorithm complexity and provide a good platform for the development of combining methods. Numerical results show that the computing time and memory size used by the DDM are more than ten times less than those used by Ansoft´s Maxwell SpiceLink-and more importantly, they are unrelated to the thickness of the pure dielectric layers

Keywords

MMIC; VLSI; capacitance; circuit CAD; integrated circuit design; integrated circuit interconnections; network parameters; VLSI circuits; algorithm complexity; capacitance matrices; computing time; domain-decomposition method; multilayered 3D interconnect structures; parameter extraction; pure dielectric layers; subdomain analysis; Algorithm design and analysis; Capacitance; Central Processing Unit; Conductors; Dielectrics; Distributed decision making; Integrated circuit interconnections; Parameter extraction; Sparse matrices; Very large scale integration;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.618405

Filename

618405