• DocumentCode
    1496372
  • Title

    Hole Mobilities of \\hbox {Si/Si}_{0.5}\\hbox {Ge}_{0.5} Quantum-Well Transistor on SOI and Strained SOI

  • Author

    Yu, W. ; Zhang, B. ; Zhao, Q.T. ; Buca, D. ; Hartmann, J. -M ; Lupták, R. ; Mussler, G. ; Fox, A. ; Bourdelle, K.K. ; Wang, X. ; Mantl, S.

  • Author_Institution
    Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
  • Volume
    33
  • Issue
    6
  • fYear
    2012
  • fDate
    6/1/2012 12:00:00 AM
  • Firstpage
    758
  • Lastpage
    760
  • Abstract
    Hole mobilities of quantum-well p-MOSFETs on strained Si (sSi)/Si0.5Ge0.5/strained SOI (sSOI) and Si/Si0.5Ge0.5/SOI heterostructure substrates are investigated as a function of temperature. Ge interdiffusion during annealing in highly strained Si0.5Ge0.5 on SOI is reduced by the growth of Si0.5Ge0.5 layer on biaxially tensely strained SOI. As a result, the sSi/Si0.5Ge0.5/sSOI transistors showed significantly higher hole mobilities than the Si/Si0.5Ge0.5/SOI device at low temperatures.
  • Keywords
    Ge-Si alloys; MOSFET; annealing; hole mobility; quantum well devices; silicon-on-insulator; Si-SiGe; annealing; biaxially tensely strained SOI; heterostructure substrates; hole mobilities; interdiffusion; quantum well p-MOSFET; silicon-on-insulator; MOSFET circuits; Silicon; Silicon germanium; Strain; Substrates; Temperature measurement; Transistors; Hole mobility; SiGe; quantum well (QW); strained Si (sSi);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2012.2190035
  • Filename
    6184280