Title :
Heterostructure barrier varactors on copper substrate
Author :
Dillner, L. ; Stake, J. ; Kollberg, E.L.
Author_Institution :
Dept. of Microelectron., Chalmers Univ. of Technol., Goteborg, Sweden
fDate :
2/18/1999 12:00:00 AM
Abstract :
The authors demonstrate a fabrication process where heterostructure barrier varactor diodes are fabricated on a copper substrate which offers reduced parasitic losses and improved thermal conductivity. This has been achieved without degrading the electrical characteristics
Keywords :
copper; losses; millimetre wave diodes; semiconductor technology; substrates; thermal conductivity; varactors; Cu; Cu substrate; fabrication process; heterostructure barrier varactors; parasitic losses reduction; thermal conductivity improvement;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19990255
