Title : 
Parametric Macromodeling of Lossy and Dispersive Multiconductor Transmission Lines
         
        
            Author : 
Ferranti, Francesco ; Antonini, Giulio ; Dhaene, Tom ; Knockaert, Luc
         
        
            Author_Institution : 
Dept. of Inf. Technol., Ghent Univ., Ghent, Belgium
         
        
        
        
        
            fDate : 
5/1/2010 12:00:00 AM
         
        
        
        
            Abstract : 
We propose an innovative parametric macromodeling technique for lossy and dispersive multiconductor transmission lines (MTLs) that can be used for interconnect modeling. It is based on a recently developed method for the analysis of lossy and dispersive MTLs extended by using the multivariate orthonormal vector fitting (MOVF) technique to build parametric macromodels in a rational form. They take into account design parameters, such as geometrical layout or substrate features, in addition to frequency. The presented technique is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. Parametric macromodels allow to perform design space exploration, design optimization, and sensitivity analysis efficiently. Numerical examples validate the proposed approach in both frequency and time domain.
         
        
            Keywords : 
dispersive channels; equivalent circuits; interconnected systems; multiconductor transmission lines; optimisation; sensitivity analysis; state-space methods; SPICE-like solvers; build parametric macromodels; design optimization; design space exploration; dispersive multiconductor transmission lines; equivalent circuit synthesis; innovative parametric macromodeling technique; interconnect modeling; lossy multiconductor transmission lines; multivariate orthonormal vector fitting; sensitivity analysis; state-space models; Interconnects; parametric macromodeling; rational approximation; transient analysis;
         
        
        
            Journal_Title : 
Advanced Packaging, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TADVP.2009.2027892