• DocumentCode
    1496821
  • Title

    Bent-beam electrothermal actuators-Part II: Linear and rotary microengines

  • Author

    Park, Jae-Sung ; Chu, Larry L. ; Oliver, Andrew D. ; Gianchandani, Yogesh B.

  • Author_Institution
    Dept. of Mech. Eng., Wisconsin Univ., Madison, WI, USA
  • Volume
    10
  • Issue
    2
  • fYear
    2001
  • fDate
    6/1/2001 12:00:00 AM
  • Firstpage
    255
  • Lastpage
    262
  • Abstract
    For Part I see L. Que, J.S. Park and Y.B. Gianchandani, ibid., vol.10, pp.247-54 (2001). This paper reports on the use of bent-beam electrothermal actuators for the purpose of generating rotary and long-throw rectilinear displacements. The rotary displacements are achieved by orthogonally arranged pairs of cascaded actuators that are used to rotate a gear. Devices were fabricated using electroplated Ni, p ++ Si, and polysilicon as structural materials. Displacements of 20-30 μm with loading forces >150 μN at actuation voltages <12 V and power dissipation <300 mW could be achieved in the orthogonally arranged actuator pairs. A design that occupies <1 mm 2 area is presented. Long-throw rectilinear displacements were achieved by inchworm mechanisms in which pairs of opposing actuators grip and shift a central shank that is cantilevered on a flexible suspension. A passive lock holds the displaced shank between pushes and when the power is off. This arrangement permits large output forces to be developed at large displacements, and requires zero standby power. Several designs were fabricated using electroplated Ni as the structural material. Forces >200 μN at displacements >100 μm were measured
  • Keywords
    microactuators; micromotors; 12 V; 300 mW; Ni; Si; bent-beam electrothermal actuator; cantilever suspension; electroplated nickel; inchworm mechanism; linear microengine; mechanical lock; microdevice; p++ silicon; polysilicon; rotary microengine; Displacement measurement; Drives; Electrothermal effects; Engines; Gears; Laboratories; Network address translation; Pneumatic actuators; Power dissipation; Voltage;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.925774
  • Filename
    925774