Heat transfer in microchannel devices using DSMC

Author

Liou, William W. ; Fang, Yichuan

Author_Institution

Dept. of Mech. & Aeronaut. Eng., Western Michigan Univ., Kalamazoo, MI, USA

Volume

10

Issue

2

fYear

2001

fDate

6/1/2001 12:00:00 AM

Firstpage

274

Lastpage

279

Abstract

The heat transfer characteristics of supersonic flows in microchannels is studied using direct simulation Monte Carlo (DSMC) method. The velocity components and the spatial coordinates of the simulated particles are calculated and recorded by using a variable-hard-sphere (VHS) collision model. The effects of Knudsen number (Kn) on the heat transfer of the microchannel flows are examined. The results show that the magnitude of the temperature jump at the wall increases with increasing Kn. The heat transfer to the isothermal wall is found to increase significantly with Kn. The possible causes for the increase of wall heat transfer are discussed

Keywords

Knudsen flow; Monte Carlo methods; channel flow; heat transfer; supersonic flow; DSMC; Knudsen number; direct simulation Monte Carlo; heat transfer characteristics; isothermal wall; microchannel devices; simulated particles; spatial coordinates; supersonic flows; temperature jump; variable-hard-sphere collision model; velocity components; wall heat transfer; Aerodynamics; Equations; Fluid flow; Gases; Heat transfer; Isothermal processes; Microchannel; Micromechanical devices; Monte Carlo methods; Temperature;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/84.925780

Filename

925780