Title :
Heat transfer in microchannel devices using DSMC
Author :
Liou, William W. ; Fang, Yichuan
Author_Institution :
Dept. of Mech. & Aeronaut. Eng., Western Michigan Univ., Kalamazoo, MI, USA
fDate :
6/1/2001 12:00:00 AM
Abstract :
The heat transfer characteristics of supersonic flows in microchannels is studied using direct simulation Monte Carlo (DSMC) method. The velocity components and the spatial coordinates of the simulated particles are calculated and recorded by using a variable-hard-sphere (VHS) collision model. The effects of Knudsen number (Kn) on the heat transfer of the microchannel flows are examined. The results show that the magnitude of the temperature jump at the wall increases with increasing Kn. The heat transfer to the isothermal wall is found to increase significantly with Kn. The possible causes for the increase of wall heat transfer are discussed
Keywords :
Knudsen flow; Monte Carlo methods; channel flow; heat transfer; supersonic flow; DSMC; Knudsen number; direct simulation Monte Carlo; heat transfer characteristics; isothermal wall; microchannel devices; simulated particles; spatial coordinates; supersonic flows; temperature jump; variable-hard-sphere collision model; velocity components; wall heat transfer; Aerodynamics; Equations; Fluid flow; Gases; Heat transfer; Isothermal processes; Microchannel; Micromechanical devices; Monte Carlo methods; Temperature;
Journal_Title :
Microelectromechanical Systems, Journal of
