Title :
Process yields for laser repair of aged, stiction-failed, MEMS devices
Author :
Rogers, James W. ; Phinney, Leslie M.
Author_Institution :
Dept. of Mech. & Ind. Eng., Illinois Univ., Urbana, IL, USA
fDate :
6/1/2001 12:00:00 AM
Abstract :
Stiction, the adhesion of micromachined components to each other or the substrate, decreases production yields and operational lifetimes for MEMS devices. A recent study demonstrated the feasibility of using a Nd:YAG, 1063 nm laser to repair 2 μm thick polycrystalline silicon microcantilevers with lengths up to 1000 μm which had adhered to the substrate. This investigation examines the influence of sample age at the time of laser irradiation on the repair of stiction-failed MEMS structures. The operating conditions for the 1064 nm, Nd:YAG laser included a fluence of 70 mJ/cm2, a repetition rate of 20 Hz, a pulse duration of 20 ns, and an exposure time of 60 s. For samples irradiated on the same day of release, repair yields were 100% for beams up to 500 μm in length. For 1000 μm long beams, the 10- and 30-μm-wide cantilevers had same-day repair yields of 56% and 71%, respectively. The experimental results show that increasing the amount of time the microstructures are adhered to the substrate before laser irradiation decreases the ability to repair stiction-failed devices with delays of longer than 1 month resulting in a decreased repair yield
Keywords :
elemental semiconductors; failure analysis; laser materials processing; micromechanical devices; silicon; stiction; 10 micron; 1064 nm; 2 micron; 20 ns; 30 micron; 500 to 1000 micron; 60 s; MEMS devices; Si; adhesion; exposure time; laser irradiation; micromachined components; operating conditions; operational lifetimes; polycrystalline silicon microcantilevers; production yields; pulse duration; repair yields; repetition rate; sample age; stiction-failure; Adhesives; Aging; Laser beams; Microelectromechanical devices; Micromechanical devices; Microstructure; Optical pulses; Production; Silicon; Structural beams;
Journal_Title :
Microelectromechanical Systems, Journal of