DocumentCode :
1497550
Title :
Raised source/drain MOSFET with dual sidewall spacers
Author :
Rodder, Mark ; Yeakley, D.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Volume :
12
Issue :
3
fYear :
1991
fDate :
3/1/1991 12:00:00 AM
Firstpage :
89
Lastpage :
91
Abstract :
A raised source/drain (S/D) MOSFET with sidewall spacers formed both before and after selective epitaxial silicon deposition in S/D regions is discussed. The second spacer overlies any faceted regions of the epitaxial silicon near the gate edge and has advantages for MOSFETs with implant-doped or in-situ doped epitaxial silicon regions. In particular, the spacer can prevent S/D dopants from being implanted through any thinner faceted regions near the gate edge, which would otherwise result in a deeper than desired junction depth in the silicon substrate. Additionally, the spacer can prevent source-to-substrate salicide shorts through the thinner faceted regions.<>
Keywords :
insulated gate field effect transistors; ion implantation; semiconductor doping; Si; dual sidewall spacers; ion implantation; raised source/drain MOSFET; selective epitaxial Si deposition; source substrate salicide shorts prevention; thinner faceted regions; Doping profiles; Etching; Fabrication; Hydrogen; Implants; MOSFET circuits; Silicides; Silicon; Substrates; Temperature;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.75721
Filename :
75721
Link To Document :
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