DocumentCode :
1497574
Title :
A Novel Test Application Scheme for High Transition Fault Coverage and Low Test Cost
Author :
Chen, Zhen ; Xiang, Dong
Author_Institution :
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
Volume :
29
Issue :
6
fYear :
2010
fDate :
6/1/2010 12:00:00 AM
Firstpage :
966
Lastpage :
976
Abstract :
This paper presents a new method for improving transition fault coverage in hybrid scan testing. It is based on a novel test application scheme, in order to break the functional dependence of broadside testing. The new technique analyzes the automatic test pattern generation conflicts in broadside test generation and skewed-load test generation, and tries to control the flip-flops with the most influence on fault coverage. The conflict-driven selection method selects some flip-flops that work in the enhanced scan mode or skewed-load scan mode. And the conflict-driven reordering method distributes the selected flip-flops into different chains. In the multiple scan chain architecture, to avoid too many scan-in pins, some chains are driven by the same scan-in pin to construct a tree-based architecture. Based on the architecture, the new test application scheme allows some flip-flops to work in enhanced scan or skewed-load mode, while most of others to work in the traditional broadside scan mode. With the efficient conflict-driven selection and reordering schemes, fault coverage is improved greatly, which can also reduce test application time and test data volume. Experimental results show that fault coverage based on the proposed method is comparable that of enhanced scan.
Keywords :
automatic test pattern generation; fault simulation; flip-flops; integrated circuit testing; trees (mathematics); automatic test pattern generation; conflict-driven reordering method; flip-flops; hybrid scan testing; selection and reordering schemes; transition fault coverage; Automatic generation control; Automatic test pattern generation; Automatic testing; Circuit faults; Circuit testing; Costs; Delay; Flip-flops; Pattern analysis; Test pattern generators; Broadside testing; fault coverage; hybrid scan testing; test cost;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2010.2048359
Filename :
5467329
Link To Document :
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