• DocumentCode
    1497885
  • Title

    Assessment of high-heat-flux thermal management schemes

  • Author

    Mudawar, Issam

  • Author_Institution
    Sch. of Mech. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    24
  • Issue
    2
  • fYear
    2001
  • fDate
    6/1/2001 12:00:00 AM
  • Firstpage
    122
  • Lastpage
    141
  • Abstract
    This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today´s cutting edge avionics cooling schemes
  • Keywords
    boiling; cooling; heat sinks; jets; reliability; sprays; thermal management (packaging); channel flow boiling; cooling schemes; detachable heat sinks; heat dissipation potential; high-heat-flux thermal management schemes; jet-impingement; microchannel heat sinks; military avionics; mini-channel heat sinks; packaging concerns; pool boiling; reliability; sprays; Aerospace electronics; Coolants; Electronic packaging thermal management; Electronics cooling; Heat sinks; Microchannel; Spraying; Temperature; Thermal management; Water heating;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.926375
  • Filename
    926375