High heat flux heat pipe mechanism for cooling of electronics

Author

Zuo, Z. Jon ; North, Mark T. ; Wert, Kevin L.

Author_Institution

Thermacore Inc., Lancaster, PA, USA

Volume

24

Issue

2

fYear

2001

fDate

6/1/2001 12:00:00 AM

Firstpage

220

Lastpage

225

Abstract

This paper discusses an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm². The mechanism utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient. A simplified hydrodynamic model in was developed to guide the proof-of-concept heat pipe design. A more detailed numerical model was also developed and will be solved to predict the heat pipe´s thermal performance. Test results of proof-of-concept heat pipes verified the heat flux capability of the advanced mechanism and the accuracy of the simplified model. Pulsating heat pipes are feasible approaches to removing increasing heat dissipation densities in electronic equipment

Keywords

cooling; heat pipes; pulsatile flow; thermal management (packaging); two-phase flow; cooling; electronic equipment; heat dissipation; heat flux; heat pipe; heat transfer coefficient; hydrodynamic model; numerical model; pulsating two-phase flow; thermal characteristics; wick structure; Contracts; Electronic packaging thermal management; Electronics cooling; Fluid flow; Heat transfer; Powders; Testing; Thermal conductivity; Thermal resistance; Water heating;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.926386

Filename

926386