Title :
Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
fDate :
6/1/2001 12:00:00 AM
Abstract :
A thermal tester has been developed for the accurate measurement of the internal thermal resistance of high-power electronic modules. The tester is designed for the simultaneous measurement of 20 electronic modules each dissipating in excess of 200 W. The heat dissipated is transmitted to the ambient by water-cooled cold plates dedicated to each test site. The tester system layout, mounting assembly, hydraulic design, cold-plate spreader design and data acquisition instrumentation are described. Sample measurements and the associated uncertainty are also discussed. The sample results are validated by comparison with thermal modeling
Keywords :
modules; test equipment; thermal management (packaging); thermal resistance measurement; 200 W; cold plate heat spreader; data acquisition instrumentation; high-power electronic module; interface material; internal thermal resistance measurement; measurement uncertainty; thermal model; thermal tester; water cooling; Cold plates; Electric resistance; Electrical resistance measurement; Electronic equipment testing; Electronic packaging thermal management; Electronics cooling; Power measurement; System testing; Temperature; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.926387
