Advanced thermal tester for accurate measurement of internal thermal resistance of high power electronic modules

Author

Sikka, Kamal K.

Author_Institution

IBM Corp., Hopewell Junction, NY, USA

Volume

24

Issue

2

fYear

2001

fDate

6/1/2001 12:00:00 AM

Firstpage

226

Lastpage

232

Abstract

A thermal tester has been developed for the accurate measurement of the internal thermal resistance of high-power electronic modules. The tester is designed for the simultaneous measurement of 20 electronic modules each dissipating in excess of 200 W. The heat dissipated is transmitted to the ambient by water-cooled cold plates dedicated to each test site. The tester system layout, mounting assembly, hydraulic design, cold-plate spreader design and data acquisition instrumentation are described. Sample measurements and the associated uncertainty are also discussed. The sample results are validated by comparison with thermal modeling

Keywords

modules; test equipment; thermal management (packaging); thermal resistance measurement; 200 W; cold plate heat spreader; data acquisition instrumentation; high-power electronic module; interface material; internal thermal resistance measurement; measurement uncertainty; thermal model; thermal tester; water cooling; Cold plates; Electric resistance; Electrical resistance measurement; Electronic equipment testing; Electronic packaging thermal management; Electronics cooling; Power measurement; System testing; Temperature; Thermal resistance;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.926387

Filename

926387