Title :
Innovative low-cost power module
Author :
Hinchley, D.A. ; Rodriguez, M. ; Rahimo, M.T. ; Jones, S.R. ; Aliwell, R.W. ; Masana, F.N. ; Shammas, N.Y.A.
Author_Institution :
Semelab plc, Lutterworth, UK
fDate :
4/1/2001 12:00:00 AM
Abstract :
Semelab has developed the Smartpack, a compact plastic power module that represents a breakthrough in the packaging of semiconductor die. By virtue of its novel construction, the Smartpack is able to offer significant cost advantages. The Smartpack structure is compared with conventional module technology. The relative thermal performance is examined using finite-element analysis. Details of Smartpack applications are provided, illustrating the module´s inherent adaptability, Finally, the suitability of Smartpack for the high-reliability market is addressed
Keywords :
finite element analysis; modules; plastic packaging; semiconductor device packaging; Semelab; Smartpack; finite-element analysis; high-reliability market; low-cost power module; packaging; plastic power module; relative thermal performance; semiconductor die;
Journal_Title :
Circuits, Devices and Systems, IEE Proceedings -
DOI :
10.1049/ip-cds:20010169
